Thermaltake CL-P0389 Passive Heatsink - Aluminum Heatsink

Socket Type: LGA 771 compatible

Heatsink Material: Aluminum Fin

All Aluminum fin and base soldering Technology

Socket Type: LGA 771 compatible. Heatsink Material: Aluminum Fin. Application for Intel Woodcrest 1U Passive Solution. All Aluminum fin and base soldering Technology. High density fins provide better heat dissipation. Dow Corning 5022 Interface material performs well.

Socket Type: LGA 771 compatible

Heatsink Material: Aluminum Fin

Application for Intel Woodcrest 1U Passive Solution

All Aluminum fin and base soldering Technology

High density fins provide better heat dissipation

Dow Corning 5022 Interface material performs well