High-conductivity thermal pad
Copper heatpipes
Maximum heat dissapation
ULTRA Thermal Memory Cooler creates a a high-conductivity thermal pad, enabling your high-speed memory to operate at peak performance. Crafted of aluminum body with copper heatpipes for maximum heat dissapation. The heatsink passively cools your modules, improves memory performance, stability, and longevity to provide users with an ease of mind due to superior passive cooling. The heatspreaders optimize the thermal conductivity of your memory modules by promoting graeter surface area. In this manner, build-up of heat is avoided and memory stability is maintained.
